In the manufacturing fields of semiconductor wafers, optical lenses, precision molds, etc., the accuracy of the workpiece plane directly determines the product performance and service life. Traditional surface grinders are difficult to meet the precision requirements at the micrometer or even nanometer levelUltra precision surface grinderBecoming the core equipment for precision machining, providing key technical support for various industries to break through precision bottlenecks and achieve manufacturing. ​

The surface grinder is equipped with a high-precision grating ruler and servo control system, with a positioning accuracy of ± 0.1 μ m and a repeated positioning accuracy of ± 0.05 μ m, which can achieve ultra precision grinding of the workpiece surface; Adopting an air static pressure guide rail and spindle system, the friction coefficient approaches zero, the operation is smooth and vibration free, and the surface roughness of the machined surface can be controlled below Ra0.005 μ m, equivalent to mirror level smoothness. For example, in semiconductor wafer processing, a surface grinder can thin and polish the backside of the wafer, ensuring that the thickness deviation of the wafer is less than 2 μ m and the flatness error is controlled within 0.5 μ m, providing a stable substrate for subsequent chip lithography processes; In the manufacturing of optical lenses, it is possible to accurately grind the surface of the lens to ensure its parallelism and transmittance, meeting the requirements of optical instruments. ​

Secondly, the equipment bed is made of high rigidity granite material with low thermal expansion coefficient, which can effectively resist the influence of temperature changes on processing accuracy. Even in the case of temperature fluctuations of ± 5 ℃ in the workshop environment, stable processing accuracy can still be maintained; The spindle adopts high-speed precision bearings and a constant temperature cooling system, with a speed of 10000-20000rpm. After long-term operation, the radial runout of the spindle is less than 0.001mm to avoid accuracy degradation caused by spindle wear; At the same time, equipped with an intelligent compensation system, it can monitor and compensate for the wear of the grinding wheel and the thermal deformation of the machine tool in real time, ensuring that the accuracy of the workpiece remains consistent after long-term continuous processing, and the batch processing pass rate reaches over 99.9%. ​

In terms of adaptability and intelligence, ultra precision surface grinders support customization and full process intelligent control. For workpieces of different materials, specialized grinding wheels and grinding parameters can be customized. For example, when processing hard and brittle materials, diamond grinding wheels can be used in conjunction with slow feed grinding technology to avoid edge breakage of the workpiece; Equipped with an automatic loading and unloading system and a visual positioning module, it can achieve automatic grabbing, positioning, and clamping of workpieces, reduce manual operation errors, and improve processing efficiency; In addition, the equipment supports integration with MES production management system, real-time uploading of processing data, realizing visualization of production progress and quality traceability, and helping enterprises build intelligent precision machining workshops. ​

From semiconductor devices to optical precision components, and then to precision mold core components, ultra precision surface grinders are driving the development of precision manufacturing towards higher precision and higher quality. Choosing a professional surface grinder is not only a choice to enhance product competitiveness, but also a key step to help enterprises break through manufacturing technology barriers and seize market high ground.