Wafer grain appearance inspection machine

NegotiableUpdate on 01/18

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

The equipment includes functions such as oscillating disc feeding, electrostatic treatment system, glass rotating platform, sensor displacement sensing, upper and lower dual CCD appearance inspection, high-frequency blowing and discharging.

Product Details

Product features:

»The equipment includes functions such as oscillating disc feeding, electrostatic treatment system, glass rotating platform, sensor displacement sensing, upper and lower dual CCD appearance inspection, and high-frequency blowing feeding;
»Low misjudgment rate, P-plane misjudgment rate ≤ 0.3%, N-plane misjudgment rate ≤ 0.7%, comprehensive misjudgment rate ≤ 1%
(Output rate=1-defect rate - misjudgment rate);
»The visual inspection efficiency is fast, UPH≥100K/H；
»The exposure light source uses blue light, which is harmless to the human eye;
»High speed CCD processing system;
»High precision DD motor rotating platform;
»Full Chinese operation interface, intuitive and easy to operate, with a good interface;
»The process parameters can be stored and retrieved, and the operation is simple.
»The software pressure storage function, if Party A needs to upgrade the software to meet MES and other management requirements in the future, Party B needs to cooperate with the upgrade or open the port, and Party B will cooperate free of charge.

Specification parameters:

technical specifications	TH-LV-01
laser device	/
Processing speed	100-150K/H
Application Fields	After wafer cracking, particle appearance inspection
Loading and unloading methods	Shaking plate feeding, high-frequency blowing feeding
Detection speed	100-150K/H
Camera frame rate	120fps
error rate	≤1%
Camera configuration	Up and down dual CCD
θ axis	360deg
Processing dimensions	40-160mil
Detection function	1. Outer ring defect;
	2. Grain size;
	3. Brightness difference;
	4. Cutting deviation;
	5. Glass defects;