Infrared Picosecond Laser Glass Drilling Machine

NegotiableUpdate on 01/18

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

Widely used in industries such as smartphone glass cutting, tablet glass cutting, LCD TV glass panel cutting, etc. The laser adopts picosecond laser, which has small edge breakage, high cutting strength, and small heat affected area

Product Details

Product features:

The laser adopts picosecond laser, which has small cutting edge breakage, high cutting intensity, and small heat affected area.
The optical system adopts imported lenses to ensure high-quality optical transmission.
The equipment and machines are all made of marble stone, which has good flatness, is not easily deformed, and has strong seismic absorption capacity, ensuring the stability of equipment processing.
The equipment adopts imported high-speed galvanometers, with high processing accuracy and good long-term stability

Specification parameters:

Equipment model	TH-G-LD-ps-20
Effective cutting stroke of machine tool	500×500（mm）
Processing positioning method	CCD positioning
wavelength	1064nm
laser power	10w 20w 30w optional
repeatability	0.005mm
positioning accuracy	±0.01mm
Processing broken edges	≤ 20um
Lower limit of drilling aperture	0.1mm
Single field mirror cutting format	50mm×50mm
Glass thickness range	≤ 1mm
Machine dimensions	1540x1460x1752mm
Whole machine weight	2300kg

Sample display:

Infrared Picosecond Glass Drilling Sample