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Suzhou Tianhong Laser Co., Ltd
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Suzhou Tianhong Laser Co., Ltd

  • E-mail

  • Phone

    13806216898

  • Address

    No. 66 Tonghe Road, Weiting Town, Suzhou Industrial Park

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Fully automatic high-speed wafer cutting machine

NegotiableUpdate on 01/18
Model
Nature of the Manufacturer
Producers
Product Category
Place of Origin
Online Consult
Overview
Widely used in integrated circuit wafers, wafer semi cutting and slicing
Product Details

Product features:

None

Specification parameters:

technical specifications Wafer back cutting machine Fully automatic wafer cutting machine Fully automatic wafer back cutting machine
laser device IPG20W/30W
Processing speed 150-200mm/s
Application Fields Half cut wafer slicing
Loading and unloading methods artificial Fully automatic module Fully automatic module
Cutting speed 150mm/s-200mm/s 150mm/s 150mm/s-200mm/s
cutting depth ≤120um ≤120um ≤120um
Alignment method artificial template matching template matching
Visual Processing Coarse positioning gray processing Binarization processing
X/Y axis movement range 140mm 140mm 140mm
θ axis 270deg 360deg 270deg
Platform levelness 5-15um 5-15um 5-15um
laser device Ruike 30W/IPG20, 30W IPG20、30W Ruike 30W/IPG20, 30W
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